Electronics

The constantly evolving electronics industry presents materials problems that require specialized equipment and creative solutions. MEE has long been a leader in laboratory testing applying traditional and advanced analytical methods. MEE helps you address your product challenges efficiently and effectively.

Typical MEE Projects for Electronic Components

•     Evaluation of PCB, IC, and pad contamination
•     Competitive analysis/reverse engineering of circuit boards and assemblies
•     Evaluation of BGA and flip-chip bump failures
•     Precision cross sectioning of buried features
•     Evaluation of flexible circuitry and layer stackups
•     Analysis of electrical failures due to dendritic growth and tin whiskers
•     Cross section and precision measurement of PCB layering and wafer metallization
•     Failure analysis of wirebond defects and solder connections
•     Composition analysis for platings including electroless nickel and ENIG
•     Examination and decapsulation of packaged IC devices